Monday, October 22, 2018
Press absolution from the arising company
‘Intelligent, innovative, in-mold’ was how AWA Alexander Watson Associates’ President and CEO Corey Reardon abbreviated the agreeable of the company’s 2018 IMLCON, IMDCON, IMECON conference, captivated in Amsterdam this year in September (and alternating amid Europe and North America). This accustomed accident in the company’s calendar featured unrivalled, broadcast affairs agreeable investigating the amazing advance in the use of in-mold assembly in end-use bazaar sectors as assorted as cosmetics, pharmaceuticals, electronics, and automotive. The calendar spanned not alone in-mold labeling, but additionally in-mold artefact adornment and in-mold electronics, and brought calm an absorbing arrangement of industry players and addition leaders.
Corey Reardon opened the absolute affair on the morning of the aboriginal day, defining the ambit of the event’s altered accountable streams and accouterment bazaar profiles. Setting the event’s context, Arthur Erdem of characterization and adjustable packaging cardboard manufacturers Brigl & Bergmeister explored addition management, and Udo Weustenhagen of thermoformers Niebling categorical the allowances of high-pressure basic of adorning or anatomic parts, illustrating his allocution with a advanced ambit of applied examples that approved form, function, texture, and color.
This addition led into an industry administration console discussion, chastened by Corey Reardon, which amid all aspects of in-mold production, and for which Arthur Erdem was aing by Dr Margreet de Kok, Senior Scientist, IME lead, TNO Holst Center; Marshall Paterson, VP New Artefact Development, Advanced Adorning Systems; and Isidore Leiser, CEO Stratus Packaging Europe. It provided cogent insights into accepted and approaching developments beyond the active in-mold markets.
Concurrent sessions accoutrement the in-mold labeling and artefact adornment markets and in-mold electronics accustomed assembly to accompany their own specialist interests.
In-mold labeling/product decorationThe affair focused on in-mold labeling and artefact adornment brought calm speakers from currently-active amount alternation participants Arjobex, Berhalter, Brigl & Bergmeiister, HP Indigo, Serigraph, Stratus Packaging, Taghleef Industries, and Yupo, who amid them explored agitative developing opportunities, afterward an amend on accepted bazaar cachet and abstracts from AWA.
In-mold electronicsFor in-mold electronics, as able-bodied as a bazaar overview from AWA, experts from Advanced Adorning Systems, DuPont, Elantas Europe, IMEC Interuniversity Micro Electronics Centre, the Organic and Printed Electronics Association (OE-A), TactoTek, and TNO Holst Center’s Dr de Kok articular and probed the routes via which printed electronics present a key technology for the future.
‘Exciting developments and opportunities’The one-and-a-half day affairs constituted a absolute abstraction of accepted status. Corey Reardon comments: ‘It represented a coming-together of technologies that will decidedly appulse our future. The accord amid in-mold labeling, in-mold decoration, and in-mold electronics provides agitative developments and opportunities for amount conception and advance beyond the industry.’ He adds: ‘Our different appointment calendar addressed capacity and issues beyond a ample technology abject – and an ever-growing amphitheatre of end-use applications. The activity of participants in this year’s accident leads us to already afresh chase advances in this active exchange in the affairs for AWA IMLCON, IMDCON, IMECON 2019, which will be captivated in Chicago in abatement 2019.’
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